Telescopic Pump Tower Takes Centre Stage at Launch
More than 700 agricultural professionals gathered at Pichon’s Landivisiau, France production site in January for the launch of the latest SC slurry tanker range, with particular attention focused on a new telescopic pump tower designed to improve slurry filling efficiency.
The pump tower, first shown publicly at Agritechnica, was demonstrated in working conditions during the two-day event. Developed to optimise filling operations, the system delivers a high flow rate while allowing precise positioning over slurry pits, including those with restricted access.
Key benefits include reduced manoeuvring time, faster filling and improved operator comfort. The telescopic design allows easier access to pits without requiring repeated tractor movements, while consistent performance is maintained when handling thicker slurry materials.
Visitors were able to see the pump tower in operation as part of a wider machine demonstration programme, which showcased multiple slurry application configurations. Technical staff explained how the system integrates with centrifugal pumping technology to deliver reliable filling and emptying across a wide range of conditions.
According to the manufacturer, the pump tower has been developed in response to contractor and farmer demand for faster turnaround times during spreading campaigns, particularly as tank capacities continue to increase and working windows tighten.
The Landivisiau event also included guided factory tours, giving visitors insight into the industrial production process behind the new components. Many attendees commented on the scale and level of automation within the facility, highlighting the move toward more standardised, high-volume manufacturing while maintaining build quality.
The new telescopic pump tower will be rolled out across selected slurry tanker models as the SC range is introduced through the dealer network in the coming months, offering operators a practical upgrade aimed squarely at improving efficiency at the fill point.
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